Semiconductor Packaging Manufacturing

Go to Course: https://www.coursera.org/learn/manufacturing

Introduction

### Course Review: Semiconductor Packaging Manufacturing on Coursera #### Overview In the fast-paced world of technology, understanding semiconductor packaging is crucial for anyone involved in electronics and manufacturing. The course titled **Semiconductor Packaging Manufacturing** offered on Coursera provides an insightful exploration into the world of semiconductor packaging, encompassing everything from the initial sorting of components to the final testing of the assembled products. Designed for both beginners and professionals alike, this course is a gem for anyone looking to deepen their knowledge in semiconductor manufacturing processes and quality assurance mechanisms. #### Course Structure The course is structured into several well-defined modules, each led by Principal Engineer **Dr. Mitul Modi** from Intel, a noteworthy figure in the field. Here’s a detailed breakdown: 1. **Welcome**: This introductory module sets the stage for the course, outlining the core areas that will be covered. It emphasizes the importance of quality assurance at each stage of semiconductor packaging, from sort to final testing. 2. **Introduction to Semiconductor Package Manufacturing 1 & 2**: These modules delve into the complexities of the packaging process, discussing various types of semiconductor packages such as BGA (Ball Grid Array) and LGA (Land Grid Array). Dr. Modi expertly explains how process flows vary between package types, which is pivotal for anyone involved in customizing or selecting appropriate packaging solutions. 3. **Assembly Part 1 & 2**: The assembly modules tackle the critical steps of preparing the die and attaching it to a substrate. Dr. Modi highlights the importance of the epoxy process and optional steps like IHS (Integrated Heat Sink) attach and ball attach, emphasizing enhancements in performance and reliability. 4. **Test and Finish**: Testing is arguably one of the most crucial phases, and this module elaborates on the various testing methods that ensure the product's quality and reliability. Understanding these processes can significantly impact yield rates and customer satisfaction. 5. **Process Control Systems (PCS)**: Here, Dr. Modi unpacks the operation of Process Control Systems, which are essential for identifying and correcting variations in the manufacturing process. The use of control charts and real-time monitoring techniques are particularly useful tools for professionals overseeing production lines. 6. **Course Summary**: The concluding module summarizes all key concepts discussed throughout the course, emphasizing the impact of market conditions on package reliability and making connections to broader trends like Moore's Law. #### Course Quality and Content Delivery The course excels in both quality and delivery. Dr. Modi’s engaging presentation style, coupled with the clarity of the content, makes complex concepts easier to grasp. The inclusion of real-world examples and case studies from Intel adds a valuable context that enhances learning. Furthermore, Coursera's platform facilitates useful interactions through quizzes and discussion forums, promoting an enriching learning experience. Learners are encouraged to engage with their peers, which fosters a supportive community atmosphere. #### Recommendation I highly recommend the **Semiconductor Packaging Manufacturing** course to anyone interested in semiconductor technologies, whether you’re a student, a professional seeking further knowledge, or someone looking to transition into the field. The course is particularly beneficial for engineers, quality assurance specialists, and product managers involved in semiconductor packaging or related fields. By the end of the course, you will not only have a comprehensive understanding of the semiconductor packaging process but also the tools necessary to make informed decisions in your projects. The skills and knowledge gained from this course can serve as a valuable asset in navigating the complexities of modern electronics manufacturing. In conclusion, whether you are looking to enhance your resume, gain practical knowledge, or explore a career in semiconductor manufacturing, this course is an excellent investment in your professional development. Enroll today and embark on a journey into the intricacies of semiconductor packaging!

Syllabus

Welcome

Welcome to Semiconductor Packaging Manufacturing, where we discuss the various stages of semiconductor package manufacturing, including sort, assembly, and final test. In addition, we will also describe how to select, build, and test the packages with the die and other components to ensure the quality of the package and total assembly performance. We will also discuss the role of Process Control Systems in semiconductor manufacturing as they relate to quality testing. Specifically, we will explore how Process Control Systems can help identify and correct process problems that cause variation and quality issues. Finally, we also demonstrate how to use control charts to monitor the process performance. These can assist in decision-making, specifically when to take action to improve the process.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses semiconductor package manufacturing. He will explain how semiconductor packaging is a complex process and discuss the three primary phases: sort, assembly, and final test.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses process flows for different types of semiconductor packages. He will explain how most process flows consist of three basic steps: sort, assembly, and final test. You will learn the details of how these steps vary depending on the package type. Mitul will give examples of process flows for BGA, LGA, 3D stacked LGA, and Stacked Hybrid packages. He will also mention that there are many more possible scenarios for process flows in semiconductor packaging.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the assembly process of semiconductor packaging and their purposes. He explains how the die is prepared, attached to a substrate, and the importance of the epoxy process. He also discuss other assembly techniques for each of these steps.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the different types of assembly steps in semiconductor packaging and their purposes. You will learn about the optional steps of IHS attach and ball attach, and how they improve the performance and reliability of the packages.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the test and final stages of semiconductor packaging and their importance. Mitul describes how sort, burn-in, test and finish operations ensure the quality, functionality and reliability of the packages before they are delivered to the customer.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the role and benefits of Process Control Systems (PCS) in semiconductor manufacturing. He will explain how PCS can detect and correct process problems that cause variation and quality issues. He will also define the concepts of targets, variation, common and special causes, control limits, and stability. Mitul will demonstrate how to use control charts to monitor the process performance and to decide when to take action to improve the process.

In conclusion of Introduction to Semiconductor Packaging, we would like to summarize the main takeaways. We started by sharing various aspects of nanoelectronics, transistor action, reliability, and customer ease of use. Then, we explored how Moore’s Law and market use conditions affect the packages' reliability needs and the materials/design choices. At the end, we saw how the common footprint of a motherboard or socket determines a package's substrate level interconnect. Thank you for joining us.