Introduction to Semiconductor Packaging

Go to Course: https://www.coursera.org/learn/introduction-to-semiconductor-packaging

Introduction

### Course Review: Introduction to Semiconductor Packaging In an age where technological advancements hinge on the efficiency and functionality of electronic devices, the "Introduction to Semiconductor Packaging" course on Coursera emerges as a timely and essential educational offering. Led by Dr. Terry Alford and Dr. Mitul Modi, both seasoned professionals with substantial experience in the semiconductor industry, this course lays a strong foundation for anyone interested in the intricate world of microelectronics and nanoelectronics. #### Overview The course dives deep into the concepts surrounding semiconductor packaging, highlighting its critical role in enhancing electronic device functionality. It begins by addressing the basics of length scales and transistor actions before exploring the implications of Moore's Law—a guiding principle that has fundamentally shaped the semiconductor industry. Furthermore, the course places a significant emphasis on the importance of packaging, which integrates and protects the various components of complex electronic systems. #### Course Structure The course structure is thoughtfully laid out in modules, making it easy for learners to digest the material incrementally. Here's a brief overview of what each module entails: 1. **Welcome**: An introduction setting the stage for the course's objectives. 2. **Nanoelectronics**: A focus on the scaling of transistors and related challenges in semiconductor packing due to nanoscale fabrication, led by industry experts. 3. **What is Packaging? Part 1 & Part 2**: These modules delve into the challenges and historical evolution of packaging techniques, the significance of heterogeneous integration, and how packaging must evolve to meet modern demands. 4. **Anatomy of a Package (Parts 1-4)**: Each part examines the different components of semiconductor packages, including connection methods, substrate design, environmental stress management, and reliability considerations. 5. **Course Summary**: A comprehensive recap of the key takeaways, which reinforces the importance of the subjects covered. #### Key Takeaways - **Moore’s Law**: Understanding its significance both historically and in the context of future developments in semiconductor technology. - **Heterogeneous Integration**: Exploring how the combination of various devices within a single package can enhance functionality while addressing current market needs. - **Reliability and Design Choices**: Gaining insight into how customer use conditions dictate design decisions, and how package footprints affect the engineering of motherboards. - **Engineering Skills**: Recognizing the cross-disciplinary nature of semiconductor packaging that requires various engineering skills and knowledge. #### Recommendations This course is highly recommended for: - **Engineering Students**: Those pursuing degrees in electrical engineering, materials science, or a related field will find this course particularly beneficial as it integrates theoretical knowledge with practical applications. - **Industry Professionals**: Existing professionals in the semiconductor field looking to update their knowledge or understand the latest trends in packaging and reliability will gain a fresh perspective. - **Tech Enthusiasts**: Anyone with a keen interest in understanding the underlying technologies of electronic devices will appreciate the course's depth and the inspiring insights from industry veterans. #### Conclusion "Introduction to Semiconductor Packaging" is not just a course; it is a gateway into the fascinating world of microelectronics and nanotechnology. With a clear syllabus, expert-led discussions, and an engaging learning structure, this course serves as an essential stepping stone for anyone aiming to contribute to the future of electronics. Whether you are looking to start a career in this domain or simply expand your knowledge, enrolling in this course will undoubtedly be a valuable investment in your educational journey.

Syllabus

Welcome

Welcome to Introduction to Semiconductor Packaging. In this course, Dr. Terry Alford and Dr. Mitul Modi will share various aspects of microelectronics and nanoelectronics. This field aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. Our aim is to introduce you to essential concepts such as length scales, transistor actions, and feature sizes of integrated circuits. We also look at historical observations and trends using Moore’s Law, which currently guides and predict development of the Semiconductor industry. Most importantly, our goal is to highlight why packaging is so important and relevant today. Furthermore, we will also explore the anatomy and function of a semiconductor package, starting with substrate-level package interconnection to the motherboard. We will also describe features as we differentiate various types of packages and how they differ in materials, design, and reliability.

In this module, ASU Professor Terry Alford and Intel's Dr. Mitul Modi discuss nanoelectronics, a field that aims to advance and improve the functionality of electronic devices by scaling transistors to smaller feature sizes. Professor Alford and Dr. Mitul Modi will lead you through length scales, transistor actions, the great transistor, feature sizes, integrated circuits, Moore’s Law, and new markets. You will also learn about the new challenges for semiconductor packing that arise from nanoscale fabrication.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the challenges and opportunities in semiconductor packaging. He will explain why we package semiconductor die, describe the silicon to semiconductor package process flow, and how packaging is evolving to meet new market demands. He will also introduce the concept of heterogeneous integration, which enables higher functionality by combining different types of devices in a single package. You will learn how semiconductor packaging connects the silicon circuitry to the rest of the system, manages the power and signals, protects the silicon circuitry, enables cooling of the circuitry, and enables spanning many length scales.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses Semiconductor Packaging; the past, present, and future. Mitul will explain the significance of Moore's Law, lead you through a condensed history of semiconductor packaging, and help you to identify the importance of packaging in the future, as well as why heterogeneous integration is important to the semiconductor industry.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the components and types of semiconductor packages. He will explain how the IC chip and the package substrate are connected by the flip chip interconnect (FLI) and how the package is connected to the motherboard by the second level interconnect (SLI). He will also describe other features that are added to some packages depending on the design, performance, and usage requirements. Mitul will also compare different types of packages and how they differ in materials, design, and reliability.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the structure and function of the package substrate in semiconductor packaging. He will describe the important features in the package substrate. Mitul will also discuss how the package substrate is designed for cost and performance trade-offs.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the mechanical, thermal, and electrical functions of semiconductor packaging. He will talk about how the package is used to manage environmental stresses, IC heat, power, and signals. He will also show how packaging involves different engineering skills and knowledge.

In this module you will have an opportunity to view a lecture video by Principal Engineer, Dr. Mitul Modi from Intel as he discusses the reliability and customer ease of use. He will explain how the customer use of a package and the market use conditions affect the reliability need and the materials/design choices for the package. You will also learn how the importance of a common package footprint and second level interconnect (SLI) for motherboard design.

In conclusion of Introduction to Semiconductor Packaging, we would like to summarize the main takeaways. We started by sharing various aspects of nanoelectronics, transistor action, reliability, and customer ease of use. Then, we explored how Moore’s Law and market use conditions affect the packages' reliability needs and the materials/design choices. At the end, we saw how the common footprint of a motherboard or socket determines a package's substrate level interconnect. Thank you for joining us.